YAMAHA 3D Hybrid Module Mounter S10
Date:2020-11-20    Hits:664
Can achieve 3D MID ※ mounting to achieve universality Expandable to mount 3D MID to enhance substrate response capabilities Flexible component/variety response capability Strong universality and switchability ※ 3D MID: 3D Molded Interconnect Device

1. Can achieve 3D mixed mounting


By adopting a newly developed dispensing head that can be interchanged with the mounting head, it is possible to achieve 3D mounting through interactive implementation of solder paste dispensing and component mounting, achieving mixed mounting.




The testing dispensing station can be disassembled and assembled on the fixed frame of the feeder.






2. Scalable to 3D MID mounting




In order to avoid being limited to regular substrate production and enable the equipment to perform solder paste dispensing and component mounting on three-dimensional objects with different heights, angles, and directions such as concave and convex surfaces, inclined surfaces, and curved surfaces, promoting the development of new models.




In the future, 3D MID production can be implemented for vehicles/medical devices, communication machines, etc. that were previously difficult to handle.






3. Enhanced substrate corresponding ability






4. Flexible component/variety corresponding ability






5. Highly versatile production interchangeability




The new refueling trolley that can install 45 feeder tracks can be mixed with existing refueling carts for use




Basic specifications




S10


Substrate size (when buffer function is not used) L50 x W30mm~L1330 x W510mm (standard L955)


(When using inlet or outlet buffering function) L50 x W30mm~L420 x W510mm


(When using inlet and outlet buffering functions) L50 x W30mm~L330 x W510mm


Substrate thickness 0.4-4.8mm


Substrate transfer direction left → right (standard)


Substrate transfer speed 900mm/sec


Mounting speed (12 axis mounting head+2 θ) 0.08sec/CHIP (45000CPH)


Installation accuracy A( μ+ three σ) CHIP ± 0.040mm


Installation accuracy B( μ+ three σ) IC ± 0.025mm


Mounting angle ± 180 °


Z-axis control/ θ Axis control AC servo motor


The height of components that can be mounted is 30mm ※ 1 (the height of components that are first mounted is within 25mm)


Mountable components 0201-120 × 90mm BGA, CSP, connectors, and other irregular components (standard 0402 to)


Component supply form: 8-56mm material belt (F1/F2 feeder), 8-88mm material belt (F3 electric feeder), rod feeder, tray


Negative pressure inspection and image inspection for components brought back


Support for multilingual graphics in Japanese, Chinese, Korean, and English


Base plate positioning clamp type base plate fixing unit, front reference, automatic adjustment of transmission width


The maximum number of feeders that can be installed is 90 types (converted by 8mm belt), with 45 connections × two


Substrate conveying height 900 ± 20mm


Host size, weight L1250 x D1750 x H1420mm, approximately 1200 kg


SURFACE MOUNT EQUIPMENT HYBRID MOUNTING EQUIPMENT SOLDER PASTE PRINTER YAMAHA DISPENSER AOI SPI 其他检查装置 REFLOW CLEANING EQUIPMENT INKJET PRINTER STORAGE SYSTEM PARTS SUPPORT SYSTEMS AND SOFTWARE

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